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Advanced MEMS Packaging

Advanced MEMS Packaging

A comprehensive guide to advanced microelectromechanical systems (MEMS) packaging methods. It presents MEMS packaging techniques such as low-temperature bonding and 3D packaging. It helps in stimulating research and development in optical, electrical, and thermal designs as well ... read full description below.

Usually ships 4-6 weeks – This is an indent title (internationally sourced to order from a local supplier).

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ISBN 9780071626231
Barcode 9780071626231
Published 22 October 2009 by McGraw-Hill Education - Europe
Format Hardback
Author(s) By Lau, John H.
By Lee, Cheng Kuo
By Premachandran, C. S.
By Aibin, Yu
Series Electronics
Availability Indent title (internationally sourced), usually ships 4-6 weeks

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Full details for this title

ISBN-13 9780071626231
ISBN-10 0071626239
Stock Available
Status Indent title (internationally sourced), usually ships 4-6 weeks
Publisher McGraw-Hill Education - Europe
Imprint McGraw-Hill Professional
Publication Date 22 October 2009
International Publication Date 1 November 2009
Publication Country United States United States
Format Hardback
Author(s) By Lau, John H.
By Lee, Cheng Kuo
By Premachandran, C. S.
By Aibin, Yu
Series Electronics
Category Electronics Engineering
Applied Optics
Number of Pages 576
Dimensions Width: 163mm
Height: 236mm
Spine: 35mm
Weight 938g
Interest Age General Audience
Reading Age General Audience
Library of Congress Microelectronic packaging, Microelectromechanical systems
NBS Text Other Specific Technologies
ONIX Text Professional and scholarly
Dewey Code 621.381045
Catalogue Code Not specified

Description of this Book

This is a comprehensive guide to advanced MEMS packaging methods. This book presents the latest and cutting-edge MEMS (Microelectromechanical systems) packaging techniques such as low-temperature bonding and 3D packaging. Written by experts in the field, Advanced MEMS Packaging serves as a valuable reference for those faced with the challenging problems created by the ever-increasing interests in MEMS devices and packaging. This authoritative guide is ideal for anyone who needs to choose a reliable, creative, high-performance, robust, and cost-effective packaging technique for MEMS devices. The book will also aid in stimulating further research and development in optical, electrical, and thermal designs as well as materials, process, manufacturing, testing, and reliability.

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Author's Bio

John H. Lau received his Ph.D. degree in Theoretical and Applied Mechanics from the University of Illinois (1977), a M.A.Sc. degree in Structural Engineering from the University of British Columbia (1973), a second M.S. degree in Engineering Physics from the University of Wisconsin (1974), and a third M.S. degree in Management Science from Fairleigh Dickinson University (1981). He also has a B.E. degree in Civil Engineering from National Taiwan University (1970). John is an interconnection technology scientist at Agilent Technologies, Inc. His current interests cover a broad range of electronic and optoelectronic packaging and manufacturing technology. Prior to Agilent, he worked for Express Packaging Systems, Hewlett-Packard Company, Sandia National Laboratory, Bechtel Power Corporation, and Exxon Production and Research Company. With more than 30 years of R&D and manufacturing experience in the electronics, petroleum, nuclear, and defense industries, he has given over 200 workshops, authored and co-authored over 180 peer reviewed technical publications, and is the author and editor of 13 books: Solder Joint Reliability; Handbook of Tape Automated Bonding; Thermal Stress and Strain in Microelectronics Packaging; The Mechanics of Solder Alloy Interconnects; Handbook of Fine Pitch Surface Mount Technology; Chip On Board Technologies for Multichip Modules; Ball Grid Array Technology; Flip Chip Technologies; Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies; Electronics Packaging: Design, Materials, Process, and Reliability; Chip Scale Package (CSP): Design, Materials, Process, Reliability, and Applications; Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies, and Microvias for Low Cost, High Density Interconnects. John served as one of the associate editors of the IEEE Transactions on Components, Packaging, and Manufacturing Technology and ASME Transactions, Journal of Electronic Packaging. He also served as general chairman, program chairman, and session chairman, and invited speaker of several IEEE, ASME, ASM, MRS, IMAPS, SEMI, and SMI International conferences. He received a few awards from ASME and IEEE for best papers and outstanding technical achievements, and is an ASME Fellow and an IEEE Fellow. He is listed in American Men and Women of Science and Who's Who in America.

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