Wheelers Books
Advanced MEMS Packaging
 

Advanced MEMS Packaging (Hardback)

By Lau, John H.
By Lee, Cheng Kuo
By Premachandran, C. S.
By Aibin, Yu

  • RRP: $488.99
  • $488.99
  • Internationally sourced

This is a comprehensive guide to advanced MEMS packaging methods. This book presents the latest and cutting-edge MEMS (Microelectromechanical systems) packaging techniques such as low-temperature bonding and 3D packaging. Written by experts in the field, Advanced MEMS Packaging s...erves as a valuable reference for those faced with the challenging problems created by the ever-increasing interests in MEMS devices and packaging. This authoritative guide is ideal for anyone who needs to choose a reliable, creative, high-performance, robust, and cost-effective packaging technique for MEMS devices. The book will also aid in stimulating further research and development in optical, electrical, and thermal designs as well as materials, process, manufacturing, testing, and reliability.
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ISBN 9780071626231
Released NZ 22 Oct 2009
Publisher McGraw-Hill Education - Europe
Format Hardback
Series Electronics
Availability
Internationally sourced (OOS locally); ships 6-12 working days

Full details for this title

ISBN-13 9780071626231
Stock Available
Status Internationally sourced (OOS locally); ships 6-12 working days
Publisher McGraw-Hill Education - Europe
Imprint McGraw-Hill Professional
Released 22 Oct 2009
Publication Country United States United States
Format Hardback
Author(s) By Lau, John H.
By Lee, Cheng Kuo
By Premachandran, C. S.
By Aibin, Yu
Series Electronics
Category Electronics Engineering
Applied Optics
Number of Pages 576
Dimensions Width: 163mm
Height: 236mm
Spine: 35mm
Dewey Code 621.381045
Weight 938g
Interest Age General Audience
Reading Age General Audience
Library of Congress Microelectronic packaging, Microelectromechanical systems
NBS Text Other Specific Technologies
ONIX Text Professional and scholarly

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