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              Books by John H. Lau

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              Electronics Manufacturing
               

              Electronics Manufacturing (Hardback)

              By Lau, John H.; Wong, C. P.; Lee, Ning-Cheng; Lee, Ricky S.

              • $289.00
              • In stock

              Provides information on lead-free, halogen-free, and conductive-adhesive technologies and their application to low-cost, reliable, and green products. This book offers an understanding of the cost, design, materials, process, equipment, and other issues of these technologies. It ...

              ISBN 9780071386241
              Published 23 August 2002 by McGraw-Hill Education - Europe
              Interest Age General Audience
              Series Electronics
              Availability
              Usually ships 6-12 working days – This title is in stock at publisher
              View details for this title
              Advanced MEMS Packaging
               

              Advanced MEMS Packaging (Hardback)

              By Lau, John H.; Lee, Cheng Kuo; Premachandran, C. S.; Aibin, Yu

              • $556.50
              • In stock

              A comprehensive guide to advanced microelectromechanical systems (MEMS) packaging methods. It presents MEMS packaging techniques such as low-temperature bonding and 3D packaging. It helps in stimulating research and development in optical, electrical, and thermal designs as well ...

              ISBN 9780071626231
              Published 22 October 2009 by McGraw-Hill Education - Europe
              Interest Age General Audience
              Series Electronics
              Availability
              View details for this title
              Heterogeneous Integrations
                

              Heterogeneous Integrations (Hardback, 1st ed. 2019)

              By Lau, John H.

              • $526.50
              • In stock

              This book addresses the fabrication of RDLs for heterogeneous integrations, and especially focuses on RDLs on: A) organic substrates, B) silicon substrates (through-silicon via (TSV)-interposers), C) silicon substrates (bridges), D) fan-out substrates, and E) ASIC, memory, LED, M ...

              ISBN 9789811372230
              Published 27 May 2019 by Springer
              Interest Age General Audience
              Availability
              This title is no longer available locally, but in stock internationally – usually ships 2-3 weeks.
              View details for this title
              Fan-Out Wafer-Level Packaging
                

              Fan-Out Wafer-Level Packaging (Hardback, 1st ed. 2018)

              By Lau, John H.

              • $417.99
              • In stock

              This comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with flip chip and fan-in wafer-level packaging.

              ISBN 9789811088834
              Published 10 May 2018 by Springer
              Interest Age 19+ years
              Availability
              Usually ships 6-12 working days – Title is in stock with supplier internationally
              View details for this title
              Mechanics of Solder Alloy Interconnects
                

              Mechanics of Solder Alloy Interconnects (Hardback, 1994 ed.)

              By Frear, D. R.; Burchett, Steven N.; Morgan, Harold S.; Lau, John H.

              • $970.50
              • In stock

              A resource to be used in developing a solder joint reliability assessment.

              ISBN 9780442015053
              Published 31 January 1994 by Van Nostrand Reinhold Inc.,U.S
              Interest Age 19+ years
              Availability
              Usually ships 6-12 working days – Title is in stock with supplier internationally
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              Chip On Board: Technology for Multichip Modules
                

              Chip On Board: Technology for Multichip Modules (Hardback, 1994 ed.)

              By Lau, John H.

              • $888.50
              • In stock

              A guide to the COB technology. It is suitable for professionals active in COB and MCM research and development, those who wish to master COB and MCM problem-solving methods, and those who must choose a cost-effective design and high-yield manufacturing process for their interconn ...

              ISBN 9780442014414
              Published 30 June 1994 by Van Nostrand Reinhold Inc.,U.S
              Interest Age General Audience
              Availability
              Usually ships 6-12 working days – Title is in stock with supplier internationally
              View details for this title
              Handbook Of Tape Automated Bonding
                

              Handbook Of Tape Automated Bonding (Hardback, 1992 ed.)

              By Lau, John H.

              • $1,096.50
              • In stock

              A guide to the TAB technology - including TAB tape, bump, inner lead bonding, encapsulation, testing, burn-in, outer lead bonding, inspection, rework, thermal management and reliability. It is suitable for professionals active in TAB research and development and those who wish to ...

              ISBN 9780442004279
              Published 31 January 1992 by Van Nostrand Reinhold Inc.,U.S
              Interest Age General Audience
              Availability
              Usually ships 6-12 working days – Title is in stock with supplier internationally
              View details for this title
              Solder Joint Reliability: Theory and Applications
                

              Solder Joint Reliability: Theory and Applications (Paperback, Softcover reprint of the original 1st ed. 1991)

              By Lau, John H.

              • $1,044.50
              • In stock

              New electronic packaging centers stimulate applications, and materials engineering and science departments have demonstrated a new vigor to improve both the materials and our understanding of them.

              ISBN 9781461367437
              Published 23 February 2014 by Springer Us
              Interest Age General Audience
              Availability
              Usually ships 6-12 working days – Title is in stock with supplier internationally
              View details for this title
              Solder Joint Reliability: Theory and Applications
                

              Solder Joint Reliability: Theory and Applications (Hardback, 1991 ed.)

              By Lau, John H.

              • $1,044.50
              • In stock

              Featuring the contributions of industrial academic experts in this area of electronics packaging, this volume examines solder failure - one of the reliability problems facing the modern surface-mounted electronics.

              ISBN 9780442002602
              Published 31 May 1991 by Van Nostrand Reinhold Inc.,U.S
              Interest Age General Audience
              Availability
              Usually ships 6-12 working days – Title is in stock with supplier internationally
              View details for this title
              Total 9 jump to: go