Books » Author » C. S. Premachandran
By Lau, John H.; Lee, Cheng Kuo; Premachandran, C. S.; Aibin, Yu
A comprehensive guide to advanced microelectromechanical systems (MEMS) packaging methods. It presents MEMS packaging techniques such as low-temperature bonding and 3D packaging. It helps in stimulating research and development in optical, electrical, and thermal designs as well ...as materials, process, manufacturing, testing, and reliability.Read more
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