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              Advanced MEMS Packaging

              Advanced MEMS Packaging (Hardback)

              By Lau, John H.; Lee, Cheng Kuo; Premachandran, C. S.; Aibin, Yu

              • RRP: $556.50
              • $556.50
              • Internationally sourced

              A comprehensive guide to advanced microelectromechanical systems (MEMS) packaging methods. It presents MEMS packaging techniques such as low-temperature bonding and 3D packaging. It helps in stimulating research and development in optical, electrical, and thermal designs as well ...

              ISBN 9780071626231
              Published 22 October 2009 by McGraw-Hill Education - Europe
              Interest Age General Audience
              Series Electronics
              Internationally sourced (OOS locally); ships 6-12 working days
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